CB 201209

Feature:

• High density packaging with a pitch of 2.54 mm（0.1 inch）max. is possible. This series requires less space and has greater EMI suppression effects.
  􀂻 Different types with the same shape are available.
  􀂻 Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability.
  􀂻 Applicable to both flow and reflow soldering.
  􀂻 High impedance cover wide frequency ranges.
  􀂻 L material type can minimize attenuation of the signal waveform due to its sharp impedance