CB 453215

Feature:

• High density packaging with a pitch of 2.54 mm（0.1 inch）max. is possible. This series requires less space and has greater EMI suppression effects.
  •  Different types with the same shape are available.
  •  Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability.
  •  Applicable to both flow and reflow soldering.
  •  High impedance cover wide frequency ranges.
  •  L material type can minimize attenuation of the signal waveform due to its sharp impedance